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Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package

Posted: 27 Apr 2007  Print Version  Bookmark and Share Subscribe

Keywords: PCB layout  Spartan-3E  FPGA  signal integrity  Spartan-3E 

[Summary of tips] Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA packageThis application note focuses on a low-cost, four- to six-layer, high-volume PCB layout for a Spartan-3E FPGA in the FT256 1mm BGA package. Useful for design engineers, managers and PCB layout staff familiar with SI related design issues, this note a......
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