T&M 
Full-spectrum brightfield inspection uncovers IC defects
Keywords: tunable broadband brightfield IC defect yield analysis signal-to-noise ratio
[Summary of tips] Chipmakers are innovating with new materials and structures to extend performance while conserving power in their next-generation ICs. This has given rise to a wide variety of new defect types and noise sources. In addition, reticle enhancement techniques, optical proximity correction and other complex lithography technologies ......Please login or register with us to view this article>>
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