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Power/Alternative Energy  

Lead Bending and Soldering Considerations for International Rectifier's Power Semiconductor Packages

Posted: 27 Jun 2003  Print Version  Bookmark and Share Subscribe

Keywords: power 

[Summary of tips] /ARTICLES/2003JUN/A/2003JUN27_POW_ICP_AN1.PDFApplication NoteAN-1031Lead Bending and Soldering Considerations forInternational Rectifier'sPower Semiconductor PackagesBy Doug Butchers and Mark Steers, International RectifierIntroductionThis application note is intended toaddress the two most frequently askedpackage-related quest......
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