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Chip-package co-design in a large flipchip application
Keywords: co-design flipchip signal integrity package
[Summary of tips] The value of chip-package co-design is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve performance while maintaining manufacturability and controlling cost. For example, through co-design it is possible to packagequite c......Please login or register with us to view this article>>
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