Combine techniques to reduce ICT cost, complexity
Keywords: ICT PCB assemblies VTEP boundary-scan vectorless testing
[Summary of tips] Industry trends are pointing to shorter design cycles with each new generation of products incorporating more features and more advanced technology. Fundamentally, the in-circuit bed-of-nails technique relies on physical access to all devices on a board. We are standing at the threshold where conventional ICT methods can no lon......|
Already registered? Login to view complete content.
|
|
||||||||||||||
|
||||||||||||||
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...















