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T&M  

Combine techniques to reduce ICT cost, complexity

Posted: 08 Sep 2008  Print Version  Bookmark and Share Subscribe

Keywords: ICT  PCB assemblies  VTEP  boundary-scan  vectorless testing 

[Summary of tips] Industry trends are pointing to shorter design cycles with each new generation of products incorporating more features and more advanced technology. Fundamentally, the in-circuit bed-of-nails technique relies on physical access to all devices on a board. We are standing at the threshold where conventional ICT methods can no lon......
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