Avoid design issues with package-aware I/O planning
Keywords: I/O planning AFS methodology package designs 45nm
[Summary of tips] Even though companies sell packaged devices and not bare chips, chips are often designed in isolation and may be either overdesigned or too large to fit the package. When chip-level I/O planning is done with no consideration of the package or the rest of the system, the result may be overly complex or unroutable package designs......|
Not a registered user?
Register FREE to view unlimited features, tutorials and products, and enable any content alert service!
 |
Already registered? Login to view complete content.
|
| Related Articles | Editor's Choice |
Android faces hurdles in low-cost arena
Android 4.0's step-up in memory and processor demands will make it less attractive in the low-cost smartphone market...
Showcasing the Rs.1,121.08 computer
A UK-based foundation claims the Raspberry Pi, a Rs.1,121.08 ($25) computer board...
Mobile processors boom
Strong growth of mobile devices up until 2016 will drive an exponential growth for mobile processors...
Google, Samsung team on Android 4.0
Samsung's Galaxy Nexus is the first smartphone launched with Google latest Android 4.0 OS...
Intel withdraws Smart TV chip business
Intel reveals plans to withdraw its Smart TV chip business.
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
