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When Pb-free meets FR4

Posted: 17 Oct 2008  Print Version  Bookmark and Share Subscribe

Keywords: Pb-free  FR4  delamination  organic solder protectant  conductive anodic filaments 

[Summary of tips] Figure 1. High reflow temperatures can cause vertical stresses that can rupture copper barrel platings.Damaged copper barrel platingsThe same expansion in the z dimension that causes delaminations can also stretch copper barrel platings vertically. It's not uncommon for the barrel plating to break under these conditions. The b......
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