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Preparing boards for assembly

Posted: 11 Nov 2008  Print Version  Bookmark and Share Subscribe

Keywords: FR-4  electroless nickel bath  Hot Air Solder Leveling  organic surface protectants 

[Summary of tips] To prevent oxidation, the copper may be coated with Pb-free solder—or, if the older technology is still being used, with Pb solder. The problem is that solder tends to arrange itself in small bumps, and not in a flat film. A blast of hot air in a process called Hot Air Solder Leveling (HASL) is used to wipe the board on e......
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