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RF/Microwave  

Highly integrated PAs aim 3G handsets, smartphones

Posted: 14 Nov 2008  Print Version  Bookmark and Share Subscribe

Keywords: 3G front ends  power amplifiers  WCDMA/HSDPA 

[Summary of tips] RF Micro Devices, Inc. has broadened its portfolio of 3G front ends for the open market with the release of two new WCDMA/HSDPA power amplifiers (PAs), the RF3267 and the RF6266. The highly integrated PAs are designed to support the critical needs of next-generation, multi-band, multi-mode 3G handsets and smartphones. Based upo......
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