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Manufacturing/Packaging  

How to handle bare die

Posted: 24 Feb 2009  Print Version  Bookmark and Share Subscribe

Keywords: bare die  electrostatic discharge 

[Summary of tips] This application note by NXP Semiconductors serves as a guideline on how to handle bare die unlike chips in a package.It is intended for introducing customers in assembly technologies requiring bare die handling like in chip on board, chip on glass and flip chip technologies. This document is aimed to rise the sensitivity and a......
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