Manufacturing/Packaging 
Package packs more power in less space
Keywords: package power semiconductors footprint
[Summary of tips] NEC Electronics Europe has launched package HSON-8, which combines the small footprint of a SOP-8 package with the thermal and electrical properties of a DPAK (aka TO-252). The device, designed for power semiconductors in automotive applications, offers similar performance as widespread packages at lower space requirements. HSO......Please login or register with us to view this article>>
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