EDA/IP 
Team-up enables MEMS/IC co-design, co-verification
Keywords: CMOS MEMS+IC 3-D CAD IC design
[Summary of tips] Cadence Design Systems Inc. has collaborated with Coventor Inc. on what the pair touts as the first environment to allow 3-D MEMS models to be designed and simulated in tandem with CMOS integrated circuitry. MEMS+IC will debut at Cadence's CDNLive EMEA conference.Traditionally, MEMS chip design requires a separate design ef......Please login or register with us to view this article>>
|
Not a registered user?
Register FREE to view unlimited features, tutorials and products, and enable any content alert service!
 |
Already registered? Login to view complete content.
|
Comment on "Team-up enables MEMS/IC co-design, c..."
Visitor0210
(To avoid code verification, simply login or register with us. It is fast and free!)
|
||||||||||||||
|
||||||||||||||
 |
Top Ranked Articles
Most Popular Articles
Search EE Times India
Max's Cool Beans
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
