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Manufacturing/Packaging  

Solder reflow attach method for RF devices

Posted: 01 Jun 2009  Print Version  Bookmark and Share Subscribe

Keywords: solder reflow  RF transistors  over-moulded plastic 

[Summary of tips] This application note by Freescale aims to provide a guideline for solder reflow mounting of high power RF transistors and ICs in over-moulded plastic packages. This document aids customers in developing an assembly process suitable for their design and their manufacturing operation. Each power amplifier (PA) design has its own......
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