Global Sources
EE Times-India
Advanced Search
News
Products
Tech Articles
App Notes
 Forum  Blogs  White Papers  Webinars  eeUniversity
 Outlook 2010   VLSI Design Conference 2010   Cornerstone of success in 2010
EE Times-India > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Wave solder in SMT packages

Posted: 11 Jun 2009  Print Version  Bookmark and Share Subscribe

Keywords: wave solder  surface mount  reflow method 

[Summary of tips] Attaching surface mount components to the bottom side of a PCB by wave solder processing is common practice. Because surface mount components are normally soldered using a reflow oven process, the impact of wave soldering and wave solder simulation methods must be understood.Process characterisation was performed to compare the......
Please login or register with us to view this article>>
 

votes:   Add to Favorites
Correct mounting for Flangeless pack...
Solder reflow attach method for RF d...
Comment on "Wave solder in SMT packages"
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Win an iPad from EE Times-India!
The engineer who creates the biggest discussion on eeForums wins the iPad. State your opinion, ask a question; it's your choice—just keep your comments interesting. Oh, and yes, industry-specific please.
From there on in, your success is measured by every view and reply. The discussion that creates the biggest buzz by January 31 gets the prize.

Joining instructions:
(If you are already a member of EE Times-India, skip to step 3)
1. First, register as a member of EE Times-Asia at http://www.eetasia.com/register.do.
2. Verify your membership by clicking on the automated registration message sent to you.
3. Log-on to EE Times-India at http://www.eetasia.com/login.do.
4. Post a message on any of the categories at http://forum.eetindia.co.in

Point system: Each message view gets one (1) point while each valid reply gets four (4) points. In case of a tie, the editors will choose the winner based on a review of the message and replies.
Contest duration: December 21, 2010 to January 31, 2011.

Top Ranked Articles
High-quality Articles
Most Popular Articles
  • Nokia brings on two Windows phones
  • Sony takes over handset biz from Ericsson JV
  • ARM-based tablets continue to reign
  • Intel's struggles outside the PC domain
  • ARM scales to 64bit architecture
  • Imec, partners aim for organic PV tech
  • e-cars look to gain perfect sound experience
  • Researchers study graphene photodetectors
  • Wearable energy storage devices power garments
  • Smartphone app packed car infotainment booms
    • Search EE Times India
    Max's Cool Beans

    Clive Maxfield Strange modes of transport and other "stuff"

    Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

     

    Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut