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Manufacturing/Packaging  

Clamping of RF devices in OMP packages

Posted: 10 Jul 2009  Print Version  Bookmark and Share Subscribe

Keywords: RF transistor  RFIC  PA design  assembly process 

[Summary of tips] This application note serves as a guide for mounting high power RF transistors and RFICs in over-moulded plastic (OMP) packages by clamping down the RF power device in the power amplifier (PA) housing. Each PA design has its own unique characteristics. Similarly, each manufacturing operation also has its own process capabilitie......
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