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Manufacturing/Packaging  

Assembling 0.5A FlipKY

Posted: 15 Jul 2009  Print Version  Bookmark and Share Subscribe

Keywords: FlipKY  Schottky diode  wafer level package 

[Summary of tips] This application note aims to help the customer prepare for, and assemble 0.5A FlipKY in an effective manner.The 0.5A FlipKY package is a Schottky diode device delivered in the form of a wafer level package (WLP). This package has both the anode and the cathode on the same side of the die. The leadless nature of WLPs can offer ......
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