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Manufacturing/Packaging  

Solder reflow for SMT packages

Posted: 16 Jul 2009  Print Version  Bookmark and Share Subscribe

Keywords: solder reflow  surface mount  PCB  board design 

[Summary of tips] This document provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which depends upon the reflow equipment used and the board design. The PCB must be individually characterised to find......
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