IBM details 3D IC design roadblocks
Keywords: 3D through-silicon via chip design
[Summary of tips] Spotlight is now on the 3D chip design.IC makers are exploring the possibly of stacking current devices in a 3D configuration. Experts define a true 3D package as one that stacks various chips vertically and then connects them by deploying through-silicon vias (TSVs). The aim is to shorten the interconnections between the chips......|
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