Global Sources
EE Times-India
 
 
Manufacturing/Packaging  

Recession, reluctance low support delay 450mm

Posted: 15 Jan 2010  Print Version  Bookmark and Share Subscribe

Keywords: 450mm  fab tool  R&D 

[Summary of tips] Despite rumblings about possible delays for the next-generation wafer size, leading fab tool companies are still reluctant to support 450mm technology.As reported, Intel, TSMC and Samsung are separately pushing for the advent of 450mm "prototype" fabs by 2012. The companies are looking for 450mm "demonstration" tools at the 32n......
Please login or register with us to view this article>>
 
 

Comment on "Recession, reluctance low support de..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Resources

Android faces hurdles in low-cost arena

Android 4.0's step-up in memory and processor demands will make it less attractive in the low-cost smartphone market...

Showcasing the Rs.1,121.08 computer

A UK-based foundation claims the Raspberry Pi, a Rs.1,121.08 ($25) computer board...

Mobile processors boom

Strong growth of mobile devices up until 2016 will drive an exponential growth for mobile processors...

Google, Samsung team on Android 4.0

Samsung's Galaxy Nexus is the first smartphone launched with Google latest Android 4.0 OS...

Intel withdraws Smart TV chip business

Intel reveals plans to withdraw its Smart TV chip business.

Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut