Intel, Carnegie Mellon work on chip packaging
Keywords: solder magnetic nanocomposite computer chip electronic packaging
[Summary of tips] Carnegie Mellon University and Intel Corp. are partnering on a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging. The research will be discussed at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington......|
Not a registered user?
Register FREE to view unlimited features, tutorials and products, and enable any content alert service!
 |
Already registered? Login to view complete content.
|
Android faces hurdles in low-cost arena
Android 4.0's step-up in memory and processor demands will make it less attractive in the low-cost smartphone market...
Showcasing the Rs.1,121.08 computer
A UK-based foundation claims the Raspberry Pi, a Rs.1,121.08 ($25) computer board...
Mobile processors boom
Strong growth of mobile devices up until 2016 will drive an exponential growth for mobile processors...
Google, Samsung team on Android 4.0
Samsung's Galaxy Nexus is the first smartphone launched with Google latest Android 4.0 OS...
Intel withdraws Smart TV chip business
Intel reveals plans to withdraw its Smart TV chip business.
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
