IMEC, Synopsys to research on 3D stacked ICs
Keywords: 3D stacked IC through-silicon vias TSV
[Summary of tips] Synopsys Inc. and IMEC have formed a collaborative research team to accelerate the development of 3D stacked IC technologies with the use of Synopsys TCAD (Technology Computer-Aided Design) finite-element method tools for characterising and optimising the reliability and electrical performance of through-silicon vias (TSVs).Whi......|
Not a registered user?
Register FREE to view unlimited features, tutorials and products, and enable any content alert service!
 |
Already registered? Login to view complete content.
|
Android faces hurdles in low-cost arena
Android 4.0's step-up in memory and processor demands will make it less attractive in the low-cost smartphone market...
Showcasing the Rs.1,121.08 computer
A UK-based foundation claims the Raspberry Pi, a Rs.1,121.08 ($25) computer board...
Mobile processors boom
Strong growth of mobile devices up until 2016 will drive an exponential growth for mobile processors...
Google, Samsung team on Android 4.0
Samsung's Galaxy Nexus is the first smartphone launched with Google latest Android 4.0 OS...
Intel withdraws Smart TV chip business
Intel reveals plans to withdraw its Smart TV chip business.
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
