Microchannels to cool down 3D IC architecture
Keywords: microfluid 3D IC 3D stack
[Summary of tips] IBM Research, École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) are collaborating on a CMOSAIC project to understand how the latest chip cooling techniques can support a 3D chip architecture. The trio seek to extend Moore's Law another 15 years using 3D sta......|
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