3D TSV chips still pre-mature
Keywords: through-silicon-vias 3D TVS MEMS CMOS
[Summary of tips] Some experts from VLSI Research after attending the International Interconnect Technology Conference (IITC) have concluded that 3D chips based on through-silicon-vias (TSV) are not ready for prime time.A plethora of companies, including ASE, Elpida, IBM, Intel, Samsung, Toshiba, TSMC and others, are exploring the possibility of......|
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