Embedded 
Performing internal inspection in MEMS devices
Keywords: MEMS devices MEMS acoustic imaging gap type defects
[Summary of tips] Non-destructive internal inspection of MEMS bonded wafer pairs via acoustic micro imaging is useful in finding, characterizing and eliminating anomalies and defects. During product development, acoustic inspection is helpful is modifying processes to avoid defects. During production, acoustic inspection spots rejects and identi......Please login or register with us to view this article>>
|
Not a registered user?
Register FREE to view unlimited features, tutorials and products, and enable any content alert service!
 |
Already registered? Login to view complete content.
|
Comment on "Performing internal inspection in ME..."
Visitor0211
(To avoid code verification, simply login or register with us. It is fast and free!)
|
||||||||||||||
|
||||||||||||||
 |
Top Ranked Articles
Most Popular Articles
Search EE Times India
Max's Cool Beans
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
