Air gaps migrate from chip- to PCB-level
Keywords: low-k dielectrics air-gap interconnections PCB
[Summary of tips] The Semiconductor Research Corp. (SRC) says that the holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level.Ultra-low capacitance air-gaps on PCBs, together with solder-less copper connections, will enable higher frequency operation while lowering power requirements, say......
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