Global Sources
EE Times-India
Stay in touch with EE Times India

3DS-IC group develop TSV manufacturing standards

Posted: 16 Dec 2010  Print Version  Bookmark and Share Subscribe 

Keywords:TSV  3DS-IC  standards  working group 

[Summary of tips] SEMI and SEMATECH have collaborated to form the Three-Dimensional Stacked Integrated Circuits (3DS-IC) group that will develop manufacturing standards for through-silicon via (TSV) technology. While TSVs are one of the most rapidly developing technologies in the semiconductor industry, cost-effective high-volume manufacturing w......
Please login or register with us to view this article>>

Comment on "3DS-IC group develop TSV manufacturi..."
*  You can enter [0] more charecters.
*Verify code:

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut

Back to Top