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3DS-IC group develop TSV manufacturing standards

Posted: 16 Dec 2010  Print Version  Bookmark and Share Subscribe 

Keywords:TSV  3DS-IC  standards  working group 

[Summary of tips] SEMI and SEMATECH have collaborated to form the Three-Dimensional Stacked Integrated Circuits (3DS-IC) group that will develop manufacturing standards for through-silicon via (TSV) technology. While TSVs are one of the most rapidly developing technologies in the semiconductor industry, cost-effective high-volume manufacturing w......
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