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Industry catches on to 3D chip mania

Posted: 08 Apr 2011     Print Version  Bookmark and Share

Keywords:through-silicon-via  TSV-based 3D chips  3d chip project  3D interconnection of wafers 

[Summary of tips] The IC industry is moving full speed ahead with a monumental and costly push to develop TSV-based 3D chips. A plethora of companies, including IBM, Intel, Samsung, Toshiba, TSMC and others, are exploring the possibility of stacking current devices in a 3D configuration.Problems plaguing the through-silicon-via (TSV) technology ......
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