IBM, Micron to produce 3D memory chips
Keywords: 3D memory chips CMOS hybrid memory
[Summary of tips] IBM and Micron Technology announced that Micron will begin production of new hybrid memory cube (HMC) device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs)—IBM's 3D chip-making process.The TSV process will be used in Micron's Hybrid Memory Cube. "IBM's advanced TSV chi......|
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