IBM researcher Veeresh Deshpande and his fellow scientists have demonstrated InGaAs/SiGe CMOS using processes for manufacturing on 300mm wafers.
Researchers in Spain have created an intelligent flexible hybrid circuit on paper, where different surface mounted devices were assembled by AgNP ink....
The idea lies in six subtransmitters whose outputs are combined to produce a signal in forward direction, while cancelling out at receive port.
The material is made up of tiny bricks, which can be designed to bend, shape and focus sound waves in a different way.
Smooth metallic lines are required to interconnect transistors within ICs and researchers have a new method to get atomic-scale smoothness.
Massive MIMO, which offers full spatial multiplexing, is expected to become a fundamental part of 5G networks.
Using LEDs, intelligent streetlighting with sensors can save electricity consumption as well as enable new applications like traffic and weather repor...
There are applications where unusual chemistries, construction and form factor are priorities, such as safely powering devices inside humans.
The entire MEMS structure with its three degrees of freedom is only 10μm thick, according to researchers.
A team from Duke University has developed a pocket colposcope that can capture images and transmit to smartphone, tablet or laptop.