CUI’s Thermal Management Group has introduced a line of high performance Peltier modules — CP20H, CP30H, CP39H, CP60H and CP85H — that the company claims has improved performance and reliability because of a proprietary "arcTEC" structure.

The company claims this structure counters the effects of thermal fatigue by incorporating a thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module, high temperature solder and larger P/N elements made from silicon ingot. The elasticity of the resin layer allows for thermal expansion and contraction during heating and cooling cycles, and therefoe reduces stress. The high-temperature solder and the larger silicon elements help speed up cooling in a more uniform manner. The end result, CUI claims, is improved reliability, performance and cycle life of Peltier modules.

The new series employs the arcTEC structure and models range from 15mm to 40mm with the lowest profile at 3.1mm. The modules are available with a ΔTmax of 77°C (Th=50°C) and current ratings ranging from 2A to 8.5A.

The modules suitable are targeted at high-density, high-power medical and industrial applications as well as refrigeration and sealed environments where forced air cooling is not an option and are available at prices starting ₹1,002.39 ($15.53) per unit for 25-unit orders.