Rogers’ Corp. has announced its RO1200 circuit materials that the company says provide enhanced signal integrity as well as reduced signal skew and crosstalk for applications like IP infrastructure, high-performance computing and test and measurement.

The ceramic-filled laminates are reinforced with woven fiberglass and offer a low dielectric constant of 3.05 and a maximum dissipation factor of 0.0017 at 10GHz.

RO1200 low-loss digital circuit materials are well-suited for high layer-count structures. Spread glass reinforcement improves rigidity and limits signal skew. The laminates provide a low coefficient of thermal expansion—8 ppm/°C in the X and Y direction and 30 ppm/°C in the Z direction—and a thermal decomposition temperature of 500°C using thermogravimetric analysis.

The RO1200 halogen-free materials carry a UL 94V-0 rating and can be used for core/edge IP routers and switches, HPC servers, switching and storage, backplanes, and automated test equipment. They are available in a variety of thicknesses in standard panel sizes of 12×18 in. and 24×18 in.

Visit Rogers' product page for more details.