Suited for use in measuring equipment and security systems, Toshiba's new photorelays come in 4-pin SO6 packages that can operate at a maximum temperature of 110°C. The new photorelays are halogen-free with a double mould structure guaranteeing isolation voltage of up to 3750Vrms.

TLP172AM and TLP172GM utilise multi-chip technology and were developed as high spec, pin-compatible versions of Toshiba existing 2.54SOP package products, TLP172A and TLP172G. A double-mould structure improves minimum voltage isolation to 3750Vrms against the 1500Vrms of the current products.

Applications for the new photorelays include factory automation systems, battery management systems (BMS), security systems, telecommunication equipment, IoT systems and replacements of mechanical relays.