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					<title>Nokia to shift phone assembly to Asia</title>
					<link>http://www.eetindia.co.in/ART_8800660941_1800007_NT_51a32286.HTM</link>
					<author>News &amp; Trends</author>
					<pubDate>2012-02-09</pubDate>
					<description>The handset maker is laying off 4,000 jobs, as it plans to shifts its phone manufacturing to Asia.</description>
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					<title>Wearable wireless sensors show 110% growth</title>
					<link>http://www.eetindia.co.in/ART_8800660932_1800005_NT_e5c9f76e.HTM</link>
					<author>News &amp; Trends</author>
					<pubDate>2012-02-09</pubDate>
					<description>MarketResearch.com's report projects a CAGR of 110 per cent over the period 2010-2014 for the global wearable wireless sensors market.</description>
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					<title>CPU-GPU collaboration boost performance by 20%</title>
					<link>http://www.eetindia.co.in/ART_8800660940_1800012_NT_1cf5da16.HTM</link>
					<author>News &amp; Trends</author>
					<pubDate>2012-02-09</pubDate>
					<description>Researchers have developed a new technique that allows GPUs and CPUs to collaborate, boosting processor performance by 20 per cent.</description>
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					<title>IBM designs India's largest data centre</title>
					<link>http://www.eetindia.co.in/ART_8800660942_1800006_NT_dd612202.HTM</link>
					<author>News &amp; Trends</author>
					<pubDate>2012-02-09</pubDate>
					<description>The 900,000 square foot data centre will help Tulip Telecom to deliver new cloud and networking services.</description>
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					<title>Is gesture recognition leading the way to 3D UIs?</title>
					<link>http://www.eetindia.co.in/ART_8800660466_1800001_TA_9e3e455a.HTM</link>
					<author>Technical Archives</author>
					<pubDate>2012-02-09</pubDate>
					<description>Know the issues surrounding gesture recognition in 3D interaction and the techniques to overcome them.</description>
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					<title>Optimising power electronics for HEV</title>
					<link>http://www.eetindia.co.in/ART_8800660547_1800008_TA_585286fe.HTM</link>
					<author>Technical Archives</author>
					<pubDate>2012-02-09</pubDate>
					<description>To achieve maximum power density, electric losses and thermal resistances must be kept to a minimum, and maximum component integration must be implemented.</description>
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					<title>Special considerations for MAX14820/MAX14821 sensor/actuator transceivers</title>
					<link>http://www.eetindia.co.in/ART_8800660434_1800004_AN_6a5b2d1a.HTM</link>
					<author>Application Notes</author>
					<pubDate>2012-02-09</pubDate>
					<description>Read about the considerations that must be taken into account to avoid falsely detecting a wake-up event.</description>
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					<title>Power ICs up low-load efficiency</title>
					<link>http://www.eetindia.co.in/ART_8800660927_1800008_NP_5ad48349.HTM</link>
					<author>New Products</author>
					<pubDate>2012-02-09</pubDate>
					<description>NXP's GreenChip power ICs boost low-load efficiency and claim ultra-low standby power at low loads.</description>
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					<title>ODU chip boosts spectrum utilisation</title>
					<link>http://www.eetindia.co.in/ART_8800660928_1800005_NP_9da17b01.HTM</link>
					<author>New Products</author>
					<pubDate>2012-02-09</pubDate>
					<description>Broadcom's BCM85810 microwave outdoor unit on a chip is said to address the need for higher bandwidth and faster time-to-market in microwave split-mount and full/all outdoor units (FODU/AODU).</description>
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					<title>Photoelectric sensors cost 30% less</title>
					<link>http://www.eetindia.co.in/ART_8800660929_1800015_NP_97bdc2e1.HTM</link>
					<author>New Products</author>
					<pubDate>2012-02-09</pubDate>
					<description>RS launches competitively priced CE-marked photoelectric sensors available in common formats.</description>
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					<item>
					<title>DC/DC converter boasts high power density</title>
					<link>http://www.eetindia.co.in/ART_8800660930_1800008_NP_3947692f.HTM</link>
					<author>New Products</author>
					<pubDate>2012-02-09</pubDate>
					<description>Vicor's Picor Cool-Power PI3106 isolated DC-DC converter boasts a high power density of 20.38mW/mm&lt;sup&gt;3&lt;/sup&gt; in a tightly-integrated 22.1 x 16.5 x 6.73mm surface mount package.</description>
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					<title>Touch controller IC offers dual touch</title>
					<link>http://www.eetindia.co.in/ART_8800660931_1800010_NP_20b0484e.HTM</link>
					<author>New Products</author>
					<pubDate>2012-02-09</pubDate>
					<description>Zytronic's ZXY100 is a touch controller chipset in 32, 64 and 128 channel controller versions offering dual touch, to cover core gesture recognition functions, as well as faster touch detection.</description>
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