Gartner forecasted that there will be 6.4 billion electronic devices connected to the internet by the end of 2016, and expects that number to approach 20.8 billion by 2020.
The 16nm UltraScale+ product portfolio combines Xilinx's 16nm FinFET+ FPGAs with integrated High-Bandwidth Memory, and support for the Cache Coherent Interconnect for Acceleration technology (CCIX).
The solution from Synopsys allows creation of higher-quality early Process Design Kits (PDKs) for design technology co-optimisation (DTCO).
NXP's LFPAK package sets a benchmark in small size with the LFPAK33 MOSFET to power secure connections for automotive OEMs.
Here's a look at impedance matching, which is used to make a load or line impedance equal that of a driving source for maximum power transfer.
In this instalment, we present five high level requirements for the IoT industrial controller that will be prototyped in upcoming articles.
The MAXREFDES82# reference design from Maxim provides both downward force and centre of mass, by collecting responses from four load cells using the MAX11254, a 24bit, 6-channel ADC.
The MicroZed Industrial IoT starter kit packs a development module based on the Xilinx Zynq-7000 SoC that combines dual ARM Cortex-A9 processor cores with numerous programmable logic cells.
Nicholas Negroponte predicts biotechnology will learn how to grow all things in the future, from communications to transportation, as well as computers.
DriveScale, formed by three engineers from Sun Microsystems and Cisco Systems, has developed a software and a network adapter that enable the creation of pools of servers and hard drives as needed.