2016-06-08 - None

India’s smartphone subscriber base to skyrocket to 810M by 2021

According to the Ericsson Mobility report, WCDMA/HSPA and LTE (3G and 4G) networks are expected to account for 65% of total subscriptions in India by 2021.

2016-06-06 -

India smartphone maker eyes China takeover

India's home-grown mobile phone giant Micromax is fast keeping up to pace with its toughest rival - China, but to realise its ambition to be in the top five global handset maker by 2020, it has to penetrate the rival's market.

2016-06-03 - Marvell

Marvell’s DMHR tech extends Wi-Fi range for connected homes

The Avastar wireless connectivity combos allow Wi-Fi devices to support extended wireless coverage by intelligently linking and sharing data or audio/video in a daisy chain topology.

2016-06-02 - Toshiba

PCIe, DDR3 SDRAM IP subsystems target custom LSI platforms

The PCI Express cores from Toshiba include standard-compliant, full-featured PCI Express 3.0/2.1/1.1 cores and high-performance, scatter-gather DMA cores and drivers (Linux & Windows).

2016-06-01 - Toni Urrutia

ICICI Bank to tap AI, take digital banking to the next level

India’s largest private bank gears up for a digital future by tapping into artificial intelligence, blockchain technology to ride the next wave of digital banking.

2016-05-31 - University of Michigan

Batman-inspired software adds 3D touch to any phone

New software developed by University of Michigan engineers and inspired, in part, by a Batman movie, could give any smartphone the capacity to sense force or pressure on its screen or body.

2016-05-23 - Max Maxfield

Programmable ASSPs link displays, mobile image sensors

Lattice's pASSPs combine programmable fabric and programmable I/O for customisation with high-performance MIPI D-PHY cores that can satisfy the demands of modern display and camera interface protocols.

2016-05-20 - ARM

64bit multicore test chip powers premium smartphones

ARM unveiled its processor test chip includes IP, EDA tools, design flow and methodology to enable new customer tape-outs on TSMC's most advanced FinFET process.

2016-05-18 - Cory Nealon

2D semiconductors give solar panels, video cameras a boost

A team of engineers found that a MoS nanocavity can increase the amount of light that optoelectronic materials absorb, which could help manufacture more powerful, efficient and flexible devices.

- CUI

15W, 25W isolated DC-DC converters tout up to 91% efficiency

CUI's PRD15 and PRD25 series devices feature input voltage up to 75VDC and target applications such as MCUs, datacom, telecom, remote sensor systems and portable electronics.