2022-12-23 - Cadence Design Systems Inc.

Cadence LPDDR5X IP Solution Targets Next-gen AI, Automotive and Mobile Applications

Cadence's LPDDR5X memory IP solution consists of a silicon-proven PHY and controller designed to connect to LPDDR5X DRAM devices that follow the JEDEC JESD209-5B standard.

2022-12-02 - Cadence Design Systems Inc.

Gear Radio Achieves First-pass Silicon Success Using Cadence and UMC Certified mmWave Reference Flow

Gear Radio Electronics successfully taped out an LNA IC on the first pass by adopting Cadence and UMC certified mmWave reference flow.

2022-11-17 - Cadence Design Systems Inc.

Cadence Launches 22Gbps GDDR6 IP at TSMC N5

The Cadence IP for GDDR6 is silicon proven on TSMC’s N5 process technology, exceeding Cadence's previous 16Gbps designs.

2022-11-10 - Cadence Design Systems Inc.

Cadence Integrity 3D-IC Platform Certified for TSMC 3DFabric Offerings

Cadence's Integrity 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC's 3DFabric offerings.

2022-11-03 - Siemens Digital Industries Software

Siemens Acquires Avery Design Systems

Siemens is strengthening its IC verification portfolio with the acquisition of Avery Design Systems.

2022-10-31 - Keysight Technologies Inc.

Synopsys, Ansys and Keysight Develop mmWave Reference Flow for TSMC Process Technology

Keysight, Synopsys, and Ansys have developed a mmWave design reference flow for TSMC's 16nm FinFET Compact (16FFC) technology.

2022-10-28 - Synopsys Inc.

Synopsys Unveils Achievements on TSMC N3E Process

Synopsys' latest achievements in EDA and IP on the TSMC N3E process provide customers with robust solutions that help them meet the stringent power, performance and area targets for their designs.

2022-10-26 - Cadence Design Systems Inc.

Cadence Design Flows Now Certified for TSMC’s Latest N4P and N3E Processes

TSMC has certified Cadence's digital and custom/analog design flows for the latest N4P and N3E processes.

2022-10-20 - Cadence Design Systems Inc.

Cadence and Samsung Foundry Expand Collaboration to Advance 3D-IC Design

Through the continued collaboration, the reference flow featuring the Cadence Integrity 3D-IC platform has been enabled to advance Samsung Foundry's 3D-IC methodology.

2022-10-12 - Cadence Design Systems Inc.

Cadence and Google Cloud Collaborating to Advance Chip Design Ecosystem

Cadence and Google Cloud are collaborating to accelerate system and semiconductor design with cloud-ready tools.