Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%
Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.
What’s on Design Engineers’ Minds in 2020?
What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option…
CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...
Minimizing Electrolytic Capacitor Size with Tiny ICs
Power Integrations has announced its latest MinE-CAP solution for high power density AC-DC converters with universal input. MinE-CAP technology reduces…
CEA-Leti CEO Sees Bright Future for Hardware
Emmanuel Sabonnadière, CEO of CEA-Leti, described Leti’s commitments and actions for a world dramatically altered by Covid-19 pandemic. Not only…
Looking Beyond Memory Encryption: Confidential Computing
Security features must be configured properly and work within a larger ecosystem...
What Enables AI and Vision at the Edge?
This year’s virtual Embedded Vision Summit will present state-of-the-art AI systems for computer vision, including tutorials and demos...
Display Driver IC Price Hike May Persist in 4Q20 as Supply Remains Tight
As prices of foundry services rose due to the tight supply of foundry capacity, IC suppliers’ DDI quotes to panel…
Quantum-Tunneling PUF-based RoT IP Improves SRAM Stability
Quantum-tunneling PUF based hardware root-of-trust IP integrates unique ID, random number generation and key storage...
Engineers, It’s Time for the Expertise in Advanced Packaging
Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...