2021-04-14 - India Science Wire

Improving Circuit Performance Through Accurate Estimation of Manufacturing Variations

IC designers must account for the tiniest fluctuations in the nanoscale dimension to ensure that each of the billions of…

2021-03-30 - Nitin Dahad

Siemens Expands Veloce Hardware-assisted Verification System

Siemens Digital Industries has added four new products in its Veloce hardware-assisted verification system for seamless approach to managing rapid…

2021-03-18 - Nitin Dahad

X-FAB Cooperating with IHP to Advance SiGe BiCMOS Technology

X-FAB Silicon Foundries and the Leibniz Institute's Innovations for High Performance Microelectronics (IHP) have announced a major industry-academic partnership that…

- Anne-Françoise Pelé

Effect Photonics Raises $37m to Deliver InP PIC

Effect Photonics, a spin-off from the Technical University of Eindhoven developing optical transceivers, has raised $37 million (about €31 million)…

2021-03-11 - Stephen Las Marias

pSemi Strengthens Semiconductor Innovation Capabilities with New Design Center in India

pSemi has opened a design center in Chennai, India to support growing demand for semiconductor products driven by 5G and…

2021-03-02 - Maurizio Di Paolo Emilio

Ultra-Low Power Chipsets for NB-IoT Networks

Sony Semiconductor highlighted the importance of providing ultra-low power chipsets to keep devices connected to today’s LTE networks and ready…

2021-02-25 - Maurizio Di Paolo Emilio

GaN ToF Laser Drivers Power the Next-Gen LiDAR

EPC's new lidars integrate the device driver directly with the GaN laser. This configuration…

2020-12-31 - IC Insights

Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%

Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.

2020-11-30 - Majeed Ahmad

What’s on Design Engineers’ Minds in 2020?

What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option…

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...