NXP Unveils Two Processors on TSMC 16nm FinFET Technology
The announcement marks the migration of NXP's S32 family of processors to increasingly advanced process nodes as automobiles continue to…
Defacto Launches Unified SoC Integration Platform
Due to the demand for more sophisticated applications, the design of systems-on-chip (SoC) is more and more complex.
Tessolve Raises $40M from Singapore-based Novo Tellus
The funding raised will be strategically deployed by Tessolve to strengthen their capabilities across chip design and embedded services offerings,…
Cerebras Packs More Compute into Second-Gen Chip
Second-gen Wafer Scale Engine has 850,000 cores and is designed for AI acceleration in data centers and supercomputers.
Improving Circuit Performance Through Accurate Estimation of Manufacturing Variations
IC designers must account for the tiniest fluctuations in the nanoscale dimension to ensure that each of the billions of…
Siemens Expands Veloce Hardware-assisted Verification System
Siemens Digital Industries has added four new products in its Veloce hardware-assisted verification system for seamless approach to managing rapid…
X-FAB Cooperating with IHP to Advance SiGe BiCMOS Technology
X-FAB Silicon Foundries and the Leibniz Institute's Innovations for High Performance Microelectronics (IHP) have announced a major industry-academic partnership that…
Effect Photonics Raises $37m to Deliver InP PIC
Effect Photonics, a spin-off from the Technical University of Eindhoven developing optical transceivers, has raised $37 million (about €31 million)…
pSemi Strengthens Semiconductor Innovation Capabilities with New Design Center in India
pSemi has opened a design center in Chennai, India to support growing demand for semiconductor products driven by 5G and…
Ultra-Low Power Chipsets for NB-IoT Networks
Sony Semiconductor highlighted the importance of providing ultra-low power chipsets to keep devices connected to today’s LTE networks and ready…