Tessolve Joins GlobalFoundries’ Design Enablement Network Program
Tessolve will provide design implementation services all the way through post-silicon productization.
NXP Semiconductors Taps AWS for EDA in the Cloud
NXP is migrating its EDA workloads from its datacenters to AWS' cloud service.
IESA Vision Summit 2021 to Focus on India’s Accelerated ESDM Growth in the Coming Decade
Now on its 16th edition, the Vision Summit will act as the platform where the industry leaders and policy makers…
Tata Electronics and SASTRA University Partner to Build Expertise in Electronics Design, Manufacturing
Tata Electronics and SASTRA are partnering to build deep domain expertise in the field of electronics design and manufacturing.
HCL Strengthens Leadership Team to Accelerate Growth in Asia
HCL Technologies has appointed country sales heads in South Korea, Taiwan, and Vietnam to drive and accelerate its presence in…
NXP Unveils Two Processors on TSMC 16nm FinFET Technology
The announcement marks the migration of NXP's S32 family of processors to increasingly advanced process nodes as automobiles continue to…
Defacto Launches Unified SoC Integration Platform
Due to the demand for more sophisticated applications, the design of systems-on-chip (SoC) is more and more complex.
Tessolve Raises $40M from Singapore-based Novo Tellus
The funding raised will be strategically deployed by Tessolve to strengthen their capabilities across chip design and embedded services offerings,…
Cerebras Packs More Compute into Second-Gen Chip
Second-gen Wafer Scale Engine has 850,000 cores and is designed for AI acceleration in data centers and supercomputers.
Improving Circuit Performance Through Accurate Estimation of Manufacturing Variations
IC designers must account for the tiniest fluctuations in the nanoscale dimension to ensure that each of the billions of…