2020-12-31 - IC Insights

Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%

Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.

2020-11-30 - Majeed Ahmad

What’s on Design Engineers’ Minds in 2020?

What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option…

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-10-30 - Maurizio Di Paolo Emilio

Minimizing Electrolytic Capacitor Size with Tiny ICs

Power Integrations has announced its latest MinE-CAP solution for high power density AC-DC converters with universal input. MinE-CAP technology reduces…

2020-10-21 - Anne-Françoise Pelé

CEA-Leti CEO Sees Bright Future for Hardware

Emmanuel Sabonnadière, CEO of CEA-Leti, described Leti’s commitments and actions for a world dramatically altered by Covid-19 pandemic. Not only…

2020-09-30 - Gary Hilson

Looking Beyond Memory Encryption: Confidential Computing

Security features must be configured properly and work within a larger ecosystem...

2020-09-15 - Sally Ward-Foxton

What Enables AI and Vision at the Edge?

This year’s virtual Embedded Vision Summit will present state-of-the-art AI systems for computer vision, including tutorials and demos...

2020-09-08 - Boyce Fan

Display Driver IC Price Hike May Persist in 4Q20 as Supply Remains Tight

As prices of foundry services rose due to the tight supply of foundry capacity, IC suppliers’ DDI quotes to panel…

2020-08-26 - Nitin Dahad

Quantum-Tunneling PUF-based RoT IP Improves SRAM Stability

Quantum-tunneling PUF based hardware root-of-trust IP integrates unique ID, random number generation and key storage...

2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...