Improving Circuit Performance Through Accurate Estimation of Manufacturing Variations
IC designers must account for the tiniest fluctuations in the nanoscale dimension to ensure that each of the billions of…
Siemens Expands Veloce Hardware-assisted Verification System
Siemens Digital Industries has added four new products in its Veloce hardware-assisted verification system for seamless approach to managing rapid…
X-FAB Cooperating with IHP to Advance SiGe BiCMOS Technology
X-FAB Silicon Foundries and the Leibniz Institute's Innovations for High Performance Microelectronics (IHP) have announced a major industry-academic partnership that…
Effect Photonics Raises $37m to Deliver InP PIC
Effect Photonics, a spin-off from the Technical University of Eindhoven developing optical transceivers, has raised $37 million (about €31 million)…
pSemi Strengthens Semiconductor Innovation Capabilities with New Design Center in India
pSemi has opened a design center in Chennai, India to support growing demand for semiconductor products driven by 5G and…
Ultra-Low Power Chipsets for NB-IoT Networks
Sony Semiconductor highlighted the importance of providing ultra-low power chipsets to keep devices connected to today’s LTE networks and ready…
GaN ToF Laser Drivers Power the Next-Gen LiDAR
EPC's new lidars integrate the device driver directly with the GaN laser. This configuration…
Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%
Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.
What’s on Design Engineers’ Minds in 2020?
What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option…
CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...