2021-03-18 - Nitin Dahad

X-FAB Cooperating with IHP to Advance SiGe BiCMOS Technology

X-FAB Silicon Foundries and the Leibniz Institute's Innovations for High Performance Microelectronics (IHP) have announced a major industry-academic partnership that includes development of advanced SiGe BiCMOS technologies.

- Anne-Françoise Pelé

Effect Photonics Raises $37m to Deliver InP PIC

Effect Photonics, a spin-off from the Technical University of Eindhoven developing optical transceivers, has raised $37 million (about €31 million) in a Series C round.

2021-03-11 - Stephen Las Marias

pSemi Strengthens Semiconductor Innovation Capabilities with New Design Center in India

pSemi has opened a design center in Chennai, India to support growing demand for semiconductor products driven by 5G and IoT applications.

2021-03-02 - Maurizio Di Paolo Emilio

Ultra-Low Power Chipsets for NB-IoT Networks

Sony Semiconductor highlighted the importance of providing ultra-low power chipsets to keep devices connected to today’s LTE networks and ready for 5G IoT...

2021-02-25 - Maurizio Di Paolo Emilio

GaN ToF Laser Drivers Power the Next-Gen LiDAR

EPC's new lidars integrate the device driver directly with the GaN laser. This configuration…

2020-12-31 - IC Insights

Fabless Company Share of IC Sales to Set New Record in 2020 at 32.9%

Fabless IC company sales forecast to surge 22% in 2020 while IDM IC sales increase by only 6%.

2020-11-30 - Majeed Ahmad

What’s on Design Engineers’ Minds in 2020?

What’s on the design engineer’s mind in 2020, the year pundits claim will change the workplace forever with the option to work remotely during the Covid-19 pandemic?

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-10-30 - Maurizio Di Paolo Emilio

Minimizing Electrolytic Capacitor Size with Tiny ICs

Power Integrations has announced its latest MinE-CAP solution for high power density AC-DC converters with universal input. MinE-CAP technology reduces the size of high-voltage electrolytic capacitors (bulk capacitors), also reducing the overall size of the adapter by up to 40%. The MinE-CAP device also drastically reduces the inrush current, making NTC thermistors unnecessary, thus increasing...

2020-10-21 - Anne-Françoise Pelé

CEA-Leti CEO Sees Bright Future for Hardware

Emmanuel Sabonnadière, CEO of CEA-Leti, described Leti’s commitments and actions for a world dramatically altered by Covid-19 pandemic. Not only is hardware making a comeback, but it is a game changer...