Smiths Interconnect's Custom Grid Array technology offers a contact layout using spring probe and target contacts to deliver the same RF performance as cabled coaxial solutions, with improved signal integrity.
Smiths Interconnect's new DaVinci Micro test socket is designed for high-speed testing of 0.35mm minimum pitches.
Running over PCIe physical layer makes open interconnect easier to adopt...
A new MIPI Alliance standard addresses four challenges: limited bandwidth, too many cables, distance limitations, and harsh environments.
The MIPI Alliance recently released MIPI A-PHY v1.0, the first automotive SerDes physical layer interface specification. Let's explore what Automotive SerDes interfaces are for and why they are important...
Funding will help Kandou bring first silicon of its 'Ferrari for retimers', as the founder calls it...
ADI and Microsoft have teamed up to produce time-of-flight (ToF) 3D imaging solutions with the goal of providing greater accuracy regardless of scene conditions. ADI will leverage Microsoft’s Azure Kinect 3D ToF technology and add its technical IC and system expertise to create solutions that would be easier to adopt...
Customers’ emotions have significant influence on their satisfaction with a service chatbot...
Allowing users to access the content they want quickly and easily, voice control will likely be the primary HMI for more consumers in the i3 than any other vehicle...
Marvell is relying on automotive Ethernet technology to create a beachhead in the emerging market of vehicles driven by rich, big data...