2021-01-22 - Rajiv Joshi

Exploring Next-Gen AI ‘from Atoms to Apps’

AI Compute Symposium explored how research efforts in various disciplines might converge to take the next level of artificial intelligence “from Atoms to Applications.”

2020-12-10 - Lefeng Shao

Heading into the 5G Era: Interview with Soitec

5G roadmap will drive technology and applications for the next decade. In an interview with EE Times China, Luis Andia, senior manager RF business development at Soitec, discusses the company’s portfolio of engineered substrates for 5G applications and how Soitec plans to embrace the new business opportunities in the 5G era...

2020-11-25 - Maurizio Di Paolo Emilio

Why Test & Measurement Matter to Wide Bandgap Semiconductors?

Keysight's Alan Wadsworth and Mike Hawes review the critical aspects of Test and Measurement for analyzing wide-bandgap solutions.

2020-10-30 - Maurizio Di Paolo Emilio

Let’s Talk About AI

Kris Ardis, executive director, Microcontrollers and Security BU, and David Dwelley, vice president and chief technology officer at Maxim Integrated, in this talk about AI...

2020-10-21 - Anne-Françoise Pelé

CEA-Leti CEO Sees Bright Future for Hardware

Emmanuel Sabonnadière, CEO of CEA-Leti, described Leti’s commitments and actions for a world dramatically altered by Covid-19 pandemic. Not only is hardware making a comeback, but it is a game changer...

2020-08-14 - Maurizio Di Paolo Emilio

IoT-based Earthquake Early-Warning System Goes Open Source

Linux Foundation announced support for Grillo’s Open EEW project in collaboration with IBM to accelerate the standardization and implementation of earthquake early warning (EEW) systems...

2020-07-28 - Sally Ward-Foxton

End-to-End Analog Neural Networks Promise Better AI Chips

Latest research on brain-inspired end-to-end analog neural networks promises fast, very low power AI chips, without on-chip ADCs and DACs...

2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...

2020-06-18 - India Science Wire

Q&A: Convert Waste to Energy with Artificial Sponge 

CSIR Young Scientist Awardee 2019 in Chemical Sciences, John Mondal, is presently working as Scientist at CSIR-IICT, Hyderabad. He has been working on a promising special project on converting waste into wealth...

2020-06-15 - Sally Ward-Foxton

Interview: Pandemic Won’t Stop Momentum in the AI Chip Industry

The startup is bringing up its 2nd-gen silicon remotely. It's banking on a surge in voice-control demand due to Covid-19...