Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices
Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…
Qualcomm Enhances Snapdragon Performance
Qualcomm has outlined details of its latest Snapdragon 888 Plus chipset, which now has a 3GHz prime CPU core and a…
Cirel System’s Stylus Controller IC Sees Strong Market Adoption
Several leading pen ODMs serving tier-1 PC OEMs are utilizing the CSAA2001 SoC to build active capacitive stylus based on…
Marvell Extends OCTEON Leadership with Industry’s First 5nm DPUs
Marvell’s OCTEON 10 DPU is the first to be designed on a 5nm process to incorporate Arm Neoverse N2 cores.
Lattice Delivers Advanced System Bandwidth, Memory Capabilities to Edge Applications
CertusPro-NX FPGAs are designed to accelerate application development for the communications, compute, industrial, automotive, and consumer markets.
Microchip Boosts GaN-on-SiC with MMIC for Satellite and 5G
Microchip's MMIC power amplifier leverages GaN-on-SiC technology to meet the stringent performance requirements of satellite communications.
pSemi Kicks Off Portfolio Expansion in Wi-Fi 6E, UWB
pSemi's UltraCMOS PE42424 RF switch now supports the latest Wi-Fi 6E and ultra-wideband (UWB) standards and technology.
Renesas Extends Support for Microsoft Azure RTOS
Customers designing with Renesas' 32-bit MCU families now have access to Microsoft Azure Real-Time Operating System (RTOS) embedded development suite.
Renesas Sensor Platform Unlocks Personalized Air Quality Experiences
Renesas' gas sensor platform features a new AI-based algorithm that enables ultra-low power selective ozone measurements.
NXP UWB Technology Helps Samsung Users Easily Find Their Misplaced Belongings
NXP's UWB and Bluetooth technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.