2021-07-20 - ACN Newswire

Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices

Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…

2021-07-02 - John Walko

Qualcomm Enhances Snapdragon Performance

Qualcomm has outlined details of its latest Snapdragon 888 Plus chipset, which now has a 3GHz prime CPU core and a…

2021-06-30 - Cirel Systems

Cirel System’s Stylus Controller IC Sees Strong Market Adoption

Several leading pen ODMs serving tier-1 PC OEMs are utilizing the CSAA2001 SoC to build active capacitive stylus based on…

- Marvell

Marvell Extends OCTEON Leadership with Industry’s First 5nm DPUs

Marvell’s OCTEON 10 DPU is the first to be designed on a 5nm process to incorporate Arm Neoverse N2 cores.

2021-06-25 - Lattice Semiconductor Corp.

Lattice Delivers Advanced System Bandwidth, Memory Capabilities to Edge Applications

CertusPro-NX FPGAs are designed to accelerate application development for the communications, compute, industrial, automotive, and consumer markets.

2021-06-23 - Maurizio Di Paolo Emilio

Microchip Boosts GaN-on-SiC with MMIC for Satellite and 5G

Microchip's MMIC power amplifier leverages GaN-on-SiC technology to meet the stringent performance requirements of satellite communications.

- pSemi Corp.

pSemi Kicks Off Portfolio Expansion in Wi-Fi 6E, UWB

pSemi's UltraCMOS PE42424 RF switch now supports the latest Wi-Fi 6E and ultra-wideband (UWB) standards and technology.

2021-06-22 - Renesas Electronics Corp.

Renesas Extends Support for Microsoft Azure RTOS

Customers designing with Renesas' 32-bit MCU families now have access to Microsoft Azure Real-Time Operating System (RTOS) embedded development suite.

2021-06-18 - Renesas Electronics Corp.

Renesas Sensor Platform Unlocks Personalized Air Quality Experiences

Renesas' gas sensor platform features a new AI-based algorithm that enables ultra-low power selective ozone measurements.

2021-06-09 - NXP Semiconductors

NXP UWB Technology Helps Samsung Users Easily Find Their Misplaced Belongings

NXP's UWB and Bluetooth technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.