2021-01-20 - Maurizio Di Paolo Emilio

CES 2021: Next-Gen EV Battery Shows Big Promise

During this year’s CES, Panasonic highlighted its strong partnership with Tesla on the EV batteries . Tesla will use Panasonic’s…

2020-12-10 - Lefeng Shao

Heading into the 5G Era: Interview with Soitec

5G roadmap will drive technology and applications for the next decade. In an interview with EE Times China, Luis Andia, senior…

2020-11-26 - George Leopold

Printed & Flexible Electronic Materials Find New Applications

Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-08-19 - Kevin Krewell

Intel Architecture Day: Time to Regain Innovation Lead

Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to…

2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...

2019-07-10 - Rick Merritt

Intel Shows First Glimpse of Packaging Technologies on Roadmap

Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.

2017-09-28 - Rick Merritt, EE Times

Intel Refreshes Desktop CPUs

Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.