2022-02-10 - VLSI Design

India to Hold VLSID 2022

VLSID 2022 brings together key stakeholders—industry, academia, researchers, regulators—in the semiconductors and electronics ecosystem.

2021-05-10 - Samsung Electronics

Samsung I-Cube4 Integrates 4 HBMs and Logic Die on Paper-thin Silicon Interposer

Samsung's I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well as stable power supply.

2021-01-20 - Maurizio Di Paolo Emilio

CES 2021: Next-Gen EV Battery Shows Big Promise

During this year’s CES, Panasonic highlighted its strong partnership with Tesla on the EV batteries . Tesla will use Panasonic’s Ni based Li ion cell in their newest EV battery packs...

2020-12-10 - Lefeng Shao

Heading into the 5G Era: Interview with Soitec

5G roadmap will drive technology and applications for the next decade. In an interview with EE Times China, Luis Andia, senior manager RF business development at Soitec, discusses the company’s portfolio of engineered substrates for 5G applications and how Soitec plans to embrace the new business opportunities in the 5G era...

2020-11-26 - George Leopold

Printed & Flexible Electronic Materials Find New Applications

Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”

2020-11-03 - CEA-Leti

CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies

CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...

2020-08-19 - Kevin Krewell

Intel Architecture Day: Time to Regain Innovation Lead

Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to give competing chips from AMD and Nvidia a run for their money...

2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...

2019-07-10 - Rick Merritt

Intel Shows First Glimpse of Packaging Technologies on Roadmap

Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.

2017-09-28 - Rick Merritt, EE Times

Intel Refreshes Desktop CPUs

Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.