2020-07-07 - Junko Yoshida

Engineers, It’s Time for the Expertise in Advanced Packaging

Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...

2019-07-10 - Rick Merritt

Intel Shows First Glimpse of Packaging Technologies on Roadmap

Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.

2017-09-28 - Rick Merritt, EE Times

Intel Refreshes Desktop CPUs

Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.