During this year’s CES, Panasonic highlighted its strong partnership with Tesla on the EV batteries . Tesla will use Panasonic’s…
5G roadmap will drive technology and applications for the next decade. In an interview with EE Times China, Luis Andia, senior…
Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...
Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to…
Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...
Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.
Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.