India to Hold VLSID 2022
VLSID 2022 brings together key stakeholders—industry, academia, researchers, regulators—in the semiconductors and electronics ecosystem.
Samsung I-Cube4 Integrates 4 HBMs and Logic Die on Paper-thin Silicon Interposer
Samsung's I-Cube4 incorporates four HBMs and one logic die on a paper-thin silicon interposer, supporting enhanced thermal management as well…
CES 2021: Next-Gen EV Battery Shows Big Promise
During this year’s CES, Panasonic highlighted its strong partnership with Tesla on the EV batteries . Tesla will use Panasonic’s…
Heading into the 5G Era: Interview with Soitec
5G roadmap will drive technology and applications for the next decade. In an interview with EE Times China, Luis Andia, senior…
Printed & Flexible Electronic Materials Find New Applications
Printed and flexible electronic materials used in smartphones are forecast to find new applications in medical devices and “smart packaging.”
CEA-Leti, Intel Collaborate to Advance Chip Design Through 3D Packaging Technologies
CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design...
Intel Architecture Day: Time to Regain Innovation Lead
Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to…
Engineers, It’s Time for the Expertise in Advanced Packaging
Arijit Raychowdhury, an expert in digital and mixed-signal design told that packaging is an area that process engineers must understand...
Intel Shows First Glimpse of Packaging Technologies on Roadmap
Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.
Intel Refreshes Desktop CPUs
Intel rolled out six new desktop processors, boosting CPU frequency at the high end and adding more x86 cores elsewhere.