STMicroelectronics’ ST-ONE Boosts Energy Efficiency in Consumer Electronics
STMicroelectronics' new chip, ST-ONE, is set to increase energy efficiency in a wide variety of AC/DC adapters.
Sensitron and EPC Collaborate on High-Power Density 350V GaN Half-Bridge IPM
Using EPC's EPC2050 GaN FET, Sensitron was able to reduce the size of its solution by 60% while also further…
Mouser Electronics Empowers Engineers Through Extensive Power Management Resources and Solutions
Mouser Electronics is offering engineers and designers an expansive resource for power management information.
India to Hold VLSID 2022
VLSID 2022 brings together key stakeholders—industry, academia, researchers, regulators—in the semiconductors and electronics ecosystem.
Winners of the First EE Awards Asia Announced
ASPENCORE, the publisher of EE Times and EDN Taiwan and Asia, recently hosted the inaugural EE Awards Asia.
EPC Expands Transistor Lineup with 40V eGaN FET
EPC's EPC2067 eGaN FET offers designers a smaller, more efficient, and more reliable device for high-performance, space-constrained applications.
Showa Denko Inks Long-Term SiC Wafer Supply Contract with Toshiba
Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.
Wise-integration Raises €2.7m to Miniaturize Chargers
Wise-integration is a spin-off from CEA-Leti that develops GaN-based integrated circuits (ICs) to maximize power supply efficiency and compactness.
Dialog’s Zero Voltage Switching Enables High Power Density for Power Supplies
Dialog's Zero Voltage Switching (ZVS) RapidCharge solution comprises the iW9801 primary-side controller and iW709 secondary-side USB PD protocol IC.
Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices
Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…