2022-07-06 - STMicroelectronics

STMicroelectronics’ ST-ONE Boosts Energy Efficiency in Consumer Electronics

STMicroelectronics' new chip, ST-ONE, is set to increase energy efficiency in a wide variety of AC/DC adapters.

2022-05-19 - Efficient Power Conversion Corp.

Sensitron and EPC Collaborate on High-Power Density 350V GaN Half-Bridge IPM

Using EPC's EPC2050 GaN FET, Sensitron was able to reduce the size of its solution by 60% while also further…

2022-04-18 - Mouser Electronics Inc.

Mouser Electronics Empowers Engineers Through Extensive Power Management Resources and Solutions

Mouser Electronics is offering engineers and designers an expansive resource for power management information.

2022-02-10 - VLSI Design

India to Hold VLSID 2022

VLSID 2022 brings together key stakeholders—industry, academia, researchers, regulators—in the semiconductors and electronics ecosystem.

2021-11-18 - EE Times Asia

Winners of the First EE Awards Asia Announced

ASPENCORE, the publisher of EE Times and EDN Taiwan and Asia, recently hosted the inaugural EE Awards Asia.

2021-10-29 - Efficient Power Conversion Corp. (EPC)

EPC Expands Transistor Lineup with 40V eGaN FET

EPC's EPC2067 eGaN FET offers designers a smaller, more efficient, and more reliable device for high-performance, space-constrained applications.

2021-09-30 - ACN Newswire

Showa Denko Inks Long-Term SiC Wafer Supply Contract with Toshiba

Showa Denko has concluded a long-term supply contract with Toshiba to supply SiC epitaxial wafers for power semiconductors.

- Anne-Françoise Pelé

Wise-integration Raises €2.7m to Miniaturize Chargers

Wise-integration is a spin-off from CEA-Leti that develops GaN-based integrated circuits (ICs) to maximize power supply efficiency and compactness.

2021-07-30 - Maurizio Di Paolo Emilio

Dialog’s Zero Voltage Switching Enables High Power Density for Power Supplies

Dialog's Zero Voltage Switching (ZVS) RapidCharge solution comprises the iW9801 primary-side controller and iW709 secondary-side USB PD protocol IC.

2021-07-20 - ACN Newswire

Tanaka Develops Brazing Filler Metal/Copper Composite Material for Power Devices

Tanaka has developed an active brazing filler metal/copper composite material that can be used as next-generation heat sinks for power…