2017-02-21 - EE Times India

Facial recognition algorithms save animals

Researcher Anil Jain and team have developed LemurFaceID, which identifies lemurs with 98.7% accuracy for humane tracking of the endangered…

2017-02-20 - Nvidia

Nvidia to power Japan’s petascale computer for AI

Built on Nvidia’s accelerated computing platform, Tsubame 3.0 is expected to deliver more than twice the performance of its predecessor,…

2017-02-17 - Julien Happich

MEMS-based optical links restructure data centres

The FireFly architecture combines the benefits of having a low transmission power and a small interference footprint, according to researchers.

2017-02-16 - Julien Happich

NanoLEDs double as light detectors

A research group has developed nanoLEDs that can be switched between light-emitting and light-detecting modes by simply changing voltage bias.

2017-02-15 - Graham Prophet

Electronic circuit breaker enables DC grids

Research for DC power grids has established the technological basis for high-performance electronic (as opposed to electromechanical) breakers.

2017-02-13 - Imec

Imec builds NFC tag on plastic

The NFC tag is manufactured in a thin-film transistor technology using indium gallium zinc oxide thin-film transistors on a plastic…

2017-02-10 - University at Buffalo

Boron-based process creates hydrogen at room temp

The method, which cuts the weight of the hydrogen source, could find application in drones, back-up generators for remote cell…

2017-02-07 - Kansas State University

Detonation technique enables graphene mass production

A team of physicists from Kansas State University has found a way to mass-produce graphene by just using hydrocarbon gas,…

2017-02-03 - Binghamton University

Heartbeat could replace passwords for health records

Researchers at Binghamton University have encrypted patient data using a person’s unique ECG as the key to lock and unlock…

2017-01-27 - Imec

Imec, EVG target accurate overlay for wafer bonding

Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D integration.