EnSilica's custom mixed-signal ASIC has completed automotive PPAP and is ready to enter into mass production as part of a future hybrid vehicle.
EnSilica has said a custom mixed signal ASIC it had developed with a tier 1 automotive supplier has completed a stringent automotive production part approval process (PPAP) and is ready to enter into mass production as part of a future hybrid vehicle.
EnSilica developed a bespoke mixed-signal ASIC device that integrates both high voltage and low noise sensing interfaces qualified to AEC-Q100 grade 0 and designed to achieve ISO26262 ASIL-D compliance. The ASIC’s functionality was developed in close collaboration with the automotive supplier to meet the needs of the OEM’s high-performance vehicle range which requires sophisticated chassis management and control. The technology is equally suited to hybrids, EVs and hydrogen fuel cell powered vehicles.
The complex ASIC uses a BCD process with high voltage transistors and combines extensive monitoring and fault detection circuits (for example open and short pins, over and under voltage detection and frequency monitoring) with duplicate redundancy on key functions.
Patrick McNamee, director of operations at EnSilica, said, “First silicon was delivered in 11 months and PPAP was completed in less than two and a half years. We’re looking forward to ramping into production in a range of new models. And with multiple chips per vehicle, the volumes are high for automotive.”