A panel of industry experts will discuss the challenges that engineers currently face in a variety of application contexts for GaN and SiC technologies.
The wide-bandgap (WBG) market has experienced expansion and rising industrial acceptance. As technology advances, businesses are creating a wide range of products that offer advantages in a number of applications for the industrial, automotive, and consumer industries, among others.
WBG semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) are supplying the market with the proper input by offering fresh solutions to the challenges that designers confront in an era where “efficiency” is the watchword.
At the inaugural PowerUP Asia conference, a panel of industry experts will discuss the challenges that engineers currently face in a variety of application contexts for GaN and SiC technologies and devices, as well as the obstacles that still need to be removed for widespread adoption, to produce improved performance and lower costs that will benefit the industry as a whole.
With the theme “Recent Advances and Upcoming Challenges for Wide Bandgap Semiconductors,” the panel discussion will be moderated by Eng. Maurizio Di Paolo Emilio, Ph.D., Editor-in-Chief of Power Electronics News and EEWeb, will feature the following panelists:
WBG is one of the key focus topics at the upcoming PowerUP Asia conference and virtual exhibition on May 24-26, 2023. Organized by AspenCore, the publisher of EETimes Asia, EETimes India, and EDN Asia, PowerUP Asia puts the spotlight on the key players and the latest technologies and trends in the power electronics industry in Asia.
PowerUP Asia builds on the success of the established PowerUP Expo, a virtual conference and exhibition being held by Power Electronics News, a sister publication under AspenCore.
For more information and to register, visit https://ve.eetasia.com/powerup2023.