Low-loss laminates up signal integrity game
Article By : Susan Nordyk
With channel speeds increasing beyond 50Gbps, RO1200 circuit materials are engineered to meet electrical and thermal/mechanical requirements of high speed designs, claims Rogers.
Rogers’ Corp. has announced its RO1200 circuit materials that the company says provide enhanced signal integrity as well as reduced signal skew and crosstalk for applications like IP infrastructure, high-performance computing and test and measurement.
The ceramic-filled laminates are reinforced with woven fiberglass and offer a low dielectric constant of 3.05 and a maximum dissipation factor of 0.0017 at 10GHz.
RO1200 low-loss digital circuit materials are well-suited for high layer-count structures. Spread glass reinforcement improves rigidity and limits signal skew. The laminates provide a low coefficient of thermal expansion—8 ppm/°C in the X and Y direction and 30 ppm/°C in the Z direction—and a thermal decomposition temperature of 500°C using thermogravimetric analysis.
The RO1200 halogen-free materials carry a UL 94V-0 rating and can be used for core/edge IP routers and switches, HPC servers, switching and storage, backplanes, and automated test equipment. They are available in a variety of thicknesses in standard panel sizes of 12×18 in. and 24×18 in.
Visit Rogers' product page for more details.