【Register Now】PowerUP Asia 2024:VIRTUAL EVENTS, MAY 21-23
Login
Register
Contact Us
Home
News
Tech Room
Aerospace
Amplifiers/Converters
Automotive
Computing
Controls/MCUs
Embedded Systems
Energy
FPGAs/PLDs
Processors/Controllers
Test & Measurement
Design Automation
Medical
Interface
Wireless and Networking
New Products
Downloads
eBook
Webinars
Special Reports
Videos
EE Awards Asia
PowerUP 2024
Virtual Events
EAC 2023
PowerUP 2024
X
Maxim Himalaya Power Modules Webinar_Survey
Watch the webinar and fill out the survey for a chance to win US$ 100 Amazon.com eGift card.
Maxim_Webinar_0302_Survey
Hidden
Email
Hidden
Name
First
Last
Suffix
I would like to sign up for Maxim’s Webinar. I agree that my provided personal information will be used to facilitate my attendance at this webinar and for webinar-topic -related communication. My information will be used in accordance with Maxim's Privacy Policy, and I agree that it may be shared with Maxim Integrated Products, Inc. ("Maxim") and Maxim's affiliates, based globally. I understand that my personal information may be transferred for processing outside my country of residence.
*
Yes, I agree
1.Are you working on a new design? (Dropdown with the following options:)
*
Yes concept stage
Yes design stage
No future project
No just researching and curious
2.What is your project/application (Open text field, up to 100 characters)
*
3.Estimated Annual Volume (Dropdown with the following options:)
*
No production (student, hobby)
<1k
1k-10k
10k-50k
50k-100k
>100k
Phone
This field is for validation purposes and should be left unchanged.
Δ
All contents are Copyright © 2024
by AspenCore,
Inc. All Rights Reserved.
About Us
Privacy Policy
Terms of Use
Continue to the Site