Top chip vendors gather this week for the second annual summit of a landmark U.S. research program to drive semiconductors forward.
An MIT spinoff is promoting on-chip micro-convective cooling as a way to beat the heat.
Intel's exascale supercomputer project may be the first to use one of three chip-stacking techniques Intel disclosed on its roadmap.
The second phase offerings in NASA Innovative Advanced Concepts (NIAC) program promise new innovative options in space
The service is the latest branch to get its electronic warfare house in order
DARPA has settled on a winged design for its spaceplane that would be propelled by a version of Aerojet Rocketdyne’s AR-22 engine
Weapon complexity and the attendant costs along with a shortage of weapon test ranges are forcing military planners to rely more heavily on simulators...
RISC-V is getting attention from just about every vertical market, but it offers a number of particular benefits for military/aerospace designers.
A market watcher sees steady reductions in electronics size, weight and power requirements.