Copper will serve as the interconnect technology for CMOS forever, no matter how small its feature sizes evolve, according to Big Blue.
IBM leads the market, accounting for 50% of market share, while HPE remains the only vendor who has grown its share to 17.8% during Q1 2017, according...
IBM has revealed new insulator material that will help it reach the 7nm node and smaller process geometries.
With the broader aim to increase yields and reduce costs, IBM Research and Tokyo Electron are collaborating to inject cognitive computing into chip-ma...
IBM researcher Veeresh Deshpande and his fellow scientists have demonstrated InGaAs/SiGe CMOS using processes for manufacturing on 300mm wafers.
LDRA tool suite and IBM Rational Doors Next Generation equip IoT system developers with traceability in OSLC environment and collaboration solutions.
IBM and the Weather Co. have developed the Weather Channel App that uses P2P mesh communication to deliver climate alerts without your mobile operator...
Foreign players are wooing Cricket Semiconductor to build the analog and power pure-play foundry in their region.
With hyperspectral imaging, it is possible to spot hidden dangers such as contaminated food or black ice and obstacles shrouded in fog.
The consortium has chosen to use the PCI Express architecture as its first transport layer with additional higher speeds of 25Gbps and beyond.